We are able to supply high quality framed laser cut solder paste stencils made to the client's specifications at very competitive prices.

Our solder paste stencils are sourced directly from reliable Chinese manufacturers who have been in this business for over 10 years and they know exactly what is needed to get the job done right first time.

Our manufacturers have a vast amount of experience in this field and support the solder paste stencil requirements of major assembly houses in China.

Our laser cut Stencils provide optimum solder paste volume control. They have smooth aperture walls and can be used for fine pitch components as well as Micro BGAs.

Electroformed and laser cut electro-polished stencils produce the best printing characteristics among stencil types. Stencil aperture design is a crucial step in optimizing the print process.

The following are a few general recommendations that should be considered when designing and ordering solder paste stencils:

Discrete components — A 10-20% reduction of stencil aperture has significantly reduced or eliminated the occurrence of mid-chip solder beads. The “home plate” design is a common method for achieving this reduction.

Fine pitch components — A surface area reduction is recommended for apertures of 20 mil pitch and finer. This reduction will help minimize solder balling and bridging that can lead to electrical shorts. The amount of reduction necessary is process dependent (5-15% is common).

Aspect ratio — For adequate release of solder paste from stencil apertures, a minimum aspect ratio of 1.5 is required. The aspect ratio is defined as the width of the aperture divided by the thickness of the stencil.



  • Framed SMT Stencils are 100% laser cut
  • Material used: Electro-polished stainless steel
  • Standard stencil thickness: 0.15mm (0.006") - Other thicknesses available on request
  • Minimum cut width: 0.05mm (0.002 inches)
  • Typical Frame size: 650 x 750 mm (25" x 29")
  • We make all aperture modifications necessary
  • Aperture tolerance: +/-9um (0.0003")
  • Allowance for fiducial data
  • Allowance for panelized data
  • Suitable applications: All component pitches down to 0.4mm (0.016”) and all discrete components down to 0201’s

Delivery Area
Australia NSW
Rest of Australia
New Zealand


Contact us to discuss your Solder Paste Stencil requirements

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